AMKOR TECHNOLOGY, INC.

Overview

Amkor Technology, Inc. is a semiconductor packaging and test services provider in the outsourced semiconductor assembly and test (OSAT) sector. Its services include advanced packaging, wafer processing, package design and semiconductor testing, supporting products such as logic, memory, analog and mixed-signal devices used in areas including mobile, automotive and data-center applications.[1][2]

Amkor serves customers through an international manufacturing network. For FY2025, it reported net sales of $6.708 billion and 30,800 employees across 12 countries as of December 31, 2025.[3][4] Its company history page describes a footprint of 20 manufacturing locations in 11 countries.[5]

Amkor states that its mission is to deliver agile, dependable manufacturing and supply-chain solutions in collaboration with customers. The company traces its packaging-solutions history to 1968.[6][7] [1]+9

Products & services

Amkor’s advanced products include flip-chip chip-scale packages (FC CSP), flip-chip ball-grid-array (FCBGA), memory packages and wafer-level packages. FC CSPs can be single- or multi-die packages for compact devices; stacked versions can combine a flip-chip die with a wirebond-connected memory die. FCBGA packages use multilayer substrates, laser-drilled vias and fine-line metallization for dense routing, with options for multiple chips and memory; 2.5D configurations can use high-density silicon interposers to integrate components such as high-bandwidth memory and graphics processors.[8]+3

Wafer-level offerings include wafer-level chip-scale packaging, wafer-level fan-out, silicon photonics, co-packaged optics and high-density fan-out. Wafer-level CSP uses no package carrier: the bumped wafer is singulated and attached directly to the system board. Amkor also offers high-density fan-out technologies, including SWIFT and S-Connect, fine-pitch bumping, advanced flip-chip and system-in-package capabilities. Mainstream products include wirebond packages, power-device packaging and MEMS packages, using leadframe or substrate-based designs.[12]+5

Services span package design, wafer bumping, wafer probing and back-grinding, assembly and packaging, burn-in, system-level and final testing, and drop shipment. Testing supports defect screening, performance grading, and quality and reliability assessment. In FY2025, Advanced Products accounted for $5.556 billion, or 82.8% of net sales; Mainstream Products accounted for $1.152 billion, or 17.2%. These figures describe broad product categories, not individual package types.[18]+3 [8]+13

Geographic presence

Amkor’s 2025 Form 10-K lists packaging and test operations in China, Japan, South Korea, Malaysia, the Philippines, Portugal, Singapore, Taiwan and Vietnam, with a factory under construction in Arizona, United States. Its manufacturing and R&D facilities schedule covers China, Japan, South Korea, Malaysia, the Philippines, Portugal, Taiwan and Vietnam, totaling 12.633 million square feet.[21]+3

At year-end 2025, Amkor reported 30,800 employees across 12 countries: approximately 95% in Asia-Pacific, 4% in Europe and 1% in the United States. Net property, plant and equipment was concentrated in South Korea ($2.098 billion), Vietnam ($518 million), Taiwan ($353 million), China ($256 million), the Philippines ($187 million), Portugal ($163 million), Japan ($142 million), Malaysia ($47 million) and the United States ($106 million).[4]+2 [21]+5

Business segments

Amkor Technology reports one operating segment, managed by its CEO as the chief operating decision maker. Its Advanced Products and Mainstream Products categories are disaggregations of net sales, not separate reportable operating segments.[26][27]

For FY2025, Advanced Products generated $5.556 billion, or 82.8% of net sales, and includes flip-chip, memory and wafer-level packaging and related test services. Mainstream Products generated $1.152 billion, or 17.2%, and comprises other wirebond packaging and related test services.[28]+2

Amkor also discloses sales by end market: communications accounted for 46%, computing 20%, automotive, industrial and other 19%, and consumer 15% of FY2025 net sales. These are market categories, not operating segments.[31] [26]+5

Company history

Amkor traces its origins to a semiconductor packaging business established in Korea in 1968 by James J. Kim; Amkor Electronics was formed in 1970. The company went public in 1998 and adopted the name Amkor Technology, Inc.[5][32]

Amkor expanded its manufacturing footprint through the 2000 acquisition of ANAM Semiconductor’s remaining Korean packaging-and-test factories, a facility in Shanghai that was ready for customer qualification in 2001, and the 2004 agreement to acquire an assembly-and-test facility in Taiwan.[33]+2 It took full ownership of Japanese joint venture J-Devices in 2015 and completed its acquisition of Portugal-based NANIUM in 2017, adding wafer-level fan-out packaging capabilities.[36][37] Giel Rutten became president and CEO in 2020; Amkor opened its Bac Ninh factory in Vietnam in 2023.[38][39] [5]+8

Sources

• AMKOR TECHNOLOGY, INC. — Full financial report (2025 Y)
  26 citations

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• amkor.com[5]
• amkor.com[6]
• amkor.com[7]
• AMKOR TECHNOLOGY, INC. — Full financial report (2026 Q 2)[18]
• www.sec.gov[24]
• amkor.com[32]
• ir.amkor.com[33]
• ir.amkor.com[34]
• ir.amkor.com[35]
• www.sec.gov[36]
• ir.amkor.com[37]
• ir.amkor.com[38]
• ir.amkor.com[39]