{ "schemaVersion": 1, "organisationId": "O-4379ff2d21fe4e43b1dd3b7acd51c754", "slug": "united-microelectronics-corp", "name": "UNITED MICROELECTRONICS CORP", "updatedAt": "2026-10-02T11:05:59.207784Z", "sections": [ { "type": "OVERVIEW", "text": "United Microelectronics Corporation (UMC) is a Taiwan-based semiconductor foundry that manufactures wafers for customers and provides mask-preparation and outsourced assembly and testing services. Its business centers on logic and specialty semiconductor manufacturing. [P148509960][https://www.umc.com/en/About/about_overview] Founded in May 1980 as Taiwan’s first semiconductor company, UMC is headquartered in Taiwan and operates fabs in Taiwan, Singapore, China and Japan. [P148509790][P148509936][https://www.umc.com/en/News/press_release/Content/corporate/20100520]\n\nUMC reported 2025 operating revenue of NT$237.6 billion (US$7.57 billion). Its official overview describes a workforce of about 20,000 and 12 production fabs; the company also lists offices across Asia, the United States and Europe. [T17033984][https://www.umc.com/en/About/about_overview] UMC describes its IC solutions as supporting “a smarter, more connected, and greener future.” [https://www.umc.com/?v=1.0.24]\n[P148509960][P148509790][P148509936][T17033984][https://www.umc.com/en/About/about_overview][https://www.umc.com/en/News/press_release/Content/corporate/20100520][https://www.umc.com/?v=1.0.24]", "updatedAt": "2026-10-02T11:05:59.207784Z" }, { "type": "PRODUCTS", "text": "United Microelectronics Corporation (UMC) manufactures customer-designed integrated circuits and provides foundry services rather than marketing a broad portfolio of branded chips. Its process technologies span 0.25µm to 14nm and include logic and mixed-signal platforms such as 28nm Poly-SiON and high-k/metal-gate, 28HPC/28HPC+, 22nm ultra-low-power and ultra-low-leakage, and 14nm FinFET. UMC describes its 14nm process as offering 55% higher speed, twice the gate density and about 50% lower power than 28nm. [P148509960][P148509876][P148509926]\n\nSpecialty offerings include embedded memory at 55/40/28/22nm for microcontrollers and automotive uses; 28nm non-volatile memory; 40/22nm RRAM; and MRAM. Other platforms include embedded high-voltage processes for display-driver ICs, BSI-CSI for image sensors, BCD for power-management circuits, and 110/90/55/40nm RF-SOI. UMC reports that its 14eHV process reduces power by more than 40% versus 28eHV. Its silicon-photonics process entered trial runs in the second half of 2025, incorporating SOI, immersion lithography, Ge/SiGe epitaxy and optical components including micro-ring modulators and GeSi electro-absorption modulators. [P148509928][P148509932]\n\nServices include wafer fabrication, mask preparation coordination, design-for-manufacturability assistance, access to EDA tools and design libraries, embedded-memory macros, analog/mixed-signal IP, and Silicon Shuttle shared test-wafer verification. UMC also offers wafer probing and turnkey subcontracted assembly and test. [P148509960][P148509962][P148509976][P148509964] In Q4 2025, 22nm and 28nm processes together accounted for 36% of revenue; 22nm alone exceeded 13%. [https://www.sec.gov/Archives/edgar/data/1033767/000119312526025557/umc-ex99_1.htm]\n[P148509960][P148509876][P148509926][P148509928][P148509932][P148509962][P148509976][P148509964][https://www.sec.gov/Archives/edgar/data/1033767/000119312526025557/umc-ex99_1.htm]", "updatedAt": "2026-10-02T11:05:59.207784Z" }, { "type": "GEOGRAPHY", "text": "UMC’s manufacturing footprint spans Taiwan, China, Singapore, and Japan. Its listed facilities include sites in Hsinchu and Tainan in Taiwan, Suzhou and Xiamen in China, Singapore, and Mie in Japan; it also lists administration offices in Hsinchu and Taipei and an R&D building in Tainan. [P148509936][T17033762]\n\nUMC reports offices in the United States, Europe, China, Japan, South Korea, and Singapore, and approximately 20,000 employees worldwide; it does not provide an employee breakdown by geography. [https://www.umc.com/en/News/press_release/Content/investor/20260225-1] The FY2025 report identifies one reportable segment, wafer fabrication, and does not provide revenue by country or region. [P148511815]\n[P148509936][T17033762][https://www.umc.com/en/News/press_release/Content/investor/20260225-1][P148511815][https://www.umc.com/en/News/press_release/Content/investor/20260225-1]", "updatedAt": "2026-10-02T11:05:59.207784Z" }, { "type": "SEGMENTS", "text": "United Microelectronics Corporation reports one operating and reportable segment: wafer fabrication. The segment manufactures chips to customers’ design specifications using UMC’s proprietary processes and techniques; it therefore represents approximately 100% of the company’s reported segment scope, with no separate business-segment revenue lines disclosed. [P148511815][T17034366]\n\nUMC also reports revenue by process technology, but these are technology categories rather than reportable business segments. In Q2 2026, 22/28nm processes accounted for 37% of revenue, including 22nm at 17.5%. [https://www.umc.com/zh-TW/News/press_release/Content/investor/20260729]\n[P148511815][T17034366][https://www.umc.com/zh-TW/News/press_release/Content/investor/20260729]", "updatedAt": "2026-10-02T11:05:59.207784Z" }, { "type": "HISTORY", "text": "United Microelectronics Corp. (UMC) was established in Hsinchu on May 22, 1980, as Taiwan’s first semiconductor company, spun out of the Industrial Technology Research Institute. [https://www.umc.com/en/Html/faqs] It became the first integrated-circuit company listed on the Taiwan Stock Exchange in 1985. [https://www.umc.com/en/Milestone/UMC_milestone]\n\nIn 1995, UMC shifted from integrated device manufacturing toward the pure-play foundry model, and Fab 8A began volume production. [https://www.umc.com/en/News/press_release/Content/investor/20000918] In 1999 it established Fab 12A, Taiwan’s first 300mm wafer fab, which began volume production in 2002. [https://www.umc.com/en/News/press_release/Content/corporate/20120524] [P148509914] In January 2000, UMC consolidated UMC, USC, UTEK, USIC and UICC into one corporation. [https://www.umc.com/en/News/press_release/Content/investor/20000110] In 2002, John Hsuan became CEO, succeeding Robert Tsao, who remained chairman. [https://www.umc.com/en/News/press_release/Content/corporate/20020401]\n\nUMC recorded 28nm pilot production in 2010 and announced mass production of customer chips using its 14nm process in 2017. [https://www.umc.com/en/Milestone/UMC_milestone/Index/2010-2019] [https://www.umc.com/en/News/press_release/Content/corporate/20170223] In 2019, it acquired the remaining 84.1% stake in Mie Fujitsu Semiconductor, renaming the company United Semiconductor Japan. [https://www.umc.com/en/News/press_release/Content/investor/20190925] UMC announced a joint 12nm process-development effort with Intel in 2024, and unveiled a new Singapore fab in 2025, with first-phase volume production planned for 2026. [https://www.umc.com/en/News/press_release/Content/corporate/20240125] [https://www.umc.com/en/News/press_release/Content/corporate/20250401]\n[P148509914][https://www.umc.com/en/Html/faqs][https://www.umc.com/en/Milestone/UMC_milestone][https://www.umc.com/en/News/press_release/Content/investor/20000918][https://www.umc.com/en/News/press_release/Content/corporate/20120524][https://www.umc.com/en/News/press_release/Content/investor/20000110][https://www.umc.com/en/News/press_release/Content/corporate/20020401][https://www.umc.com/en/Milestone/UMC_milestone/Index/2010-2019][https://www.umc.com/en/News/press_release/Content/corporate/20170223][https://www.umc.com/en/News/press_release/Content/investor/20190925][https://www.umc.com/en/News/press_release/Content/corporate/20240125][https://www.umc.com/en/News/press_release/Content/corporate/20250401]", "updatedAt": "2026-10-02T11:05:59.207784Z" } ], "sources": [ { "id": "P148509960", "href": "https://app.finbar.com/go?id=P148509960", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "https://www.umc.com/en/About/about_overview", "href": "https://www.umc.com/en/About/about_overview", "label": "www.umc.com" }, { "id": "P148509790", "href": "https://app.finbar.com/go?id=P148509790", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "P148509936", "href": "https://app.finbar.com/go?id=P148509936", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "https://www.umc.com/en/News/press_release/Content/corporate/20100520", "href": "https://www.umc.com/en/News/press_release/Content/corporate/20100520", "label": "www.umc.com" }, { "id": "T17033984", "href": "https://app.finbar.com/go?id=T17033984", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "https://www.umc.com/?v=1.0.24", "href": "https://www.umc.com/?v=1.0.24", "label": "www.umc.com" }, { "id": "P148509876", "href": "https://app.finbar.com/go?id=P148509876", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "P148509926", "href": "https://app.finbar.com/go?id=P148509926", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "P148509928", "href": "https://app.finbar.com/go?id=P148509928", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "P148509932", "href": "https://app.finbar.com/go?id=P148509932", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "P148509962", "href": "https://app.finbar.com/go?id=P148509962", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "P148509976", "href": "https://app.finbar.com/go?id=P148509976", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "P148509964", "href": "https://app.finbar.com/go?id=P148509964", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526025557/umc-ex99_1.htm", "href": "https://www.sec.gov/Archives/edgar/data/1033767/000119312526025557/umc-ex99_1.htm", "label": "www.sec.gov" }, { "id": "T17033762", "href": "https://app.finbar.com/go?id=T17033762", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "https://www.umc.com/en/News/press_release/Content/investor/20260225-1", "href": "https://www.umc.com/en/News/press_release/Content/investor/20260225-1", "label": "www.umc.com" }, { "id": "P148511815", "href": "https://app.finbar.com/go?id=P148511815", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "T17034366", "href": "https://app.finbar.com/go?id=T17034366", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "https://www.umc.com/zh-TW/News/press_release/Content/investor/20260729", "href": "https://www.umc.com/zh-TW/News/press_release/Content/investor/20260729", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/Html/faqs", "href": "https://www.umc.com/en/Html/faqs", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/Milestone/UMC_milestone", "href": "https://www.umc.com/en/Milestone/UMC_milestone", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/News/press_release/Content/investor/20000918", "href": "https://www.umc.com/en/News/press_release/Content/investor/20000918", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/News/press_release/Content/corporate/20120524", "href": "https://www.umc.com/en/News/press_release/Content/corporate/20120524", "label": "www.umc.com" }, { "id": "P148509914", "href": "https://app.finbar.com/go?id=P148509914", "label": "UNITED MICROELECTRONICS CORP — Full financial report (2025 Y)", "documentId": "D-9e386080ec8b46aa81cd5b42ffa3a28c" }, { "id": "https://www.umc.com/en/News/press_release/Content/investor/20000110", "href": "https://www.umc.com/en/News/press_release/Content/investor/20000110", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/News/press_release/Content/corporate/20020401", "href": "https://www.umc.com/en/News/press_release/Content/corporate/20020401", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/Milestone/UMC_milestone/Index/2010-2019", "href": "https://www.umc.com/en/Milestone/UMC_milestone/Index/2010-2019", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/News/press_release/Content/corporate/20170223", "href": "https://www.umc.com/en/News/press_release/Content/corporate/20170223", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/News/press_release/Content/investor/20190925", "href": "https://www.umc.com/en/News/press_release/Content/investor/20190925", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/News/press_release/Content/corporate/20240125", "href": "https://www.umc.com/en/News/press_release/Content/corporate/20240125", "label": "www.umc.com" }, { "id": "https://www.umc.com/en/News/press_release/Content/corporate/20250401", "href": "https://www.umc.com/en/News/press_release/Content/corporate/20250401", "label": "www.umc.com" } ] }