{ "schemaVersion": 1, "organisationId": "O-568e4491a0f3431f9df456d5c6bf6bfe", "slug": "soitec", "name": "SOITEC", "updatedAt": "2026-10-04T14:51:56.566367Z", "sections": [ { "type": "OVERVIEW", "text": "Soitec is a French semiconductor-materials company that designs and manufactures engineered substrates—specialized wafers used by semiconductor foundries and integrated device manufacturers to produce chips. Its portfolio is led by Silicon-on-Insulator (SOI) substrates and also includes piezoelectric and wide-bandgap materials such as GaN, SiC and InP. These products serve markets including mobile communications, data centers and AI, automotive, industrial applications and smart devices. [P142551134][P142551133]\n\nThe company describes its founding mission as developing engineered substrates for the semiconductor industry, with a broader purpose of designing planet-friendly technology and high-performance semiconductors. Founded in Grenoble, France, Soitec sells worldwide and has major production operations in France and Singapore, as well as production through a Shanghai partnership. [P142551133][https://www.soitec.com/en/company/people/culture/purpose---values][T16300390][P142551134]\n\nFor the year ended 31 March 2026, Soitec reported revenue of €592 million. The company reported more than 2,200 employees in July 2025; this is a dated company figure rather than a year-end FY2025–26 headcount. [P142556338][https://www.soitec.com/docs/default-source/agm-documents/2025/en/soitec-held-its-annual-general-meeting--soitec-agm-2025.pdf?Status=Master&sfvrsn=44d88300_1]\n[P142551134][P142551133][https://www.soitec.com/en/company/people/culture/purpose---values][T16300390][P142556338][https://www.soitec.com/docs/default-source/agm-documents/2025/en/soitec-held-its-annual-general-meeting--soitec-agm-2025.pdf?Status=Master&sfvrsn=44d88300_1][https://www.soitec.com/en/company/people/culture/purpose---values][https://www.soitec.com/docs/default-source/agm-documents/2025/en/soitec-held-its-annual-general-meeting--soitec-agm-2025.pdf?Status=Master&sfvrsn=44d88300_1]", "updatedAt": "2026-10-04T14:51:56.566367Z" }, { "type": "PRODUCTS", "text": "Soitec’s products are engineered semiconductor substrates and wafers used by chip manufacturers. Its platforms include **RF-SOI** substrates for radio-frequency components in smartphones, cellular and Wi-Fi systems; **FD-SOI**, whose thin, uniform silicon and buried-oxide layers support energy-efficient chips and analog/digital integration across 65 nm to 18 nm process nodes; and **POI** substrates, with a piezoelectric layer over oxide and high-resistivity silicon, for surface-acoustic-wave filters designed for wider bandwidth and lower temperature sensitivity. Soitec also offers a POI-based Process Design Kit developed with SAWNICS. [P142551283][P142551272][P123298832][P142551279][P142551134][P142551279]\n\nOther platforms address distinct applications: **Power-SOI** substrates are designed for high-voltage automotive and industrial power electronics, including battery-management, motor-control and driver circuits; **Photonics-SOI** supports silicon-photonics components and optical data-center interconnects; and **SmartSiC™** substrates target power devices for electric vehicles and charging infrastructure. Soitec also offers **GaN-on-SiC and GaN-on-Si epitaxial substrates** for RF and power applications, and identifies indium phosphide substrates in its materials portfolio. [P142551281][P123298839][P142551319][P142551315][P142551134]\n\nThe platforms are enabled by **Smart Cut™**, a layer-transfer process that uses ion implantation and wafer bonding to transfer ultra-thin monocrystalline layers onto another substrate. The company describes its offering principally as wafer sales, supplemented by license income; it does not provide a complete product-platform revenue breakdown in the cited reporting. [P22133825][P142551134][P142551134]\n[P142551283][P142551272][P123298832][P142551279][P142551134][P142551281][P123298839][P142551319][P142551315][P22133825]", "updatedAt": "2026-10-04T14:51:56.566367Z" }, { "type": "GEOGRAPHY", "text": "Soitec is headquartered in Bernin, France. Its main manufacturing footprint includes the Bernin 1–4 facilities in France and a production facility in Pasir Ris, Singapore; it also has a China-based manufacturing partnership with Shanghai Simgui. [https://www.soitec.com/home/group/contact] [T16300390] [P142551369]\n\nAt March 31, 2026, Soitec reported 2,128 employees: 1,616 in Bernin, France, and 375 in Singapore. Other listed employee locations include Besançon, Grenoble, Le Bourget-du-Lac and Paris in France; Hasselt in Belgium; and the United States, Japan, Taiwan, South Korea and Shanghai, China. [T16300397] In FY2025–26, revenue by delivery location was 61% Asia, 30% Europe and 9% United States; the corresponding FY2024–25 shares were 65%, 27% and 8%. [T16300505] [P142555392]\n[T16300390][P142551369][T16300397][T16300505][P142555392][https://www.soitec.com/home/group/contact]", "updatedAt": "2026-10-04T14:51:56.566367Z" }, { "type": "SEGMENTS", "text": "For FY2025–26, Soitec reported three business segments, with total revenue of €592 million: **Mobile Communications** generated €309 million (approximately 52%), **Edge & Cloud AI** €214 million (approximately 36%), and **Automotive & Industrial** €69 million (approximately 12%). [T14183955]\n\nMobile Communications focuses on RF-SOI and POI substrates used in smartphone radio-frequency front-end modules, cellular and Wi-Fi filters, and connectivity applications. [P142551283][P142551279] Edge & Cloud AI includes Photonics-SOI for high-speed optical interconnections in data centers and FD-SOI solutions for edge AI. [P142551274][P142556904] Automotive & Industrial includes Power-SOI for automotive and industrial power electronics, and SmartSiC substrates for power and energy conversion, including electric-vehicle applications. [P142551281][P142551319]\n\nSoitec also presents revenue geographically, a separate view from its business segments: Asia accounted for 61% of FY2025–26 revenue, Europe 30%, and the United States 9%. [T16300505]\n[T14183955][P142551283][P142551279][P142551274][P142556904][P142551281][P142551319][T16300505]", "updatedAt": "2026-10-04T14:51:56.566367Z" }, { "type": "HISTORY", "text": "Soitec was founded in 1992 by CEA engineers André-Jacques Auberton-Hervé and Jean-Michel Lamure. The company’s origins lie in Smart Cut™, a layer-transfer technology used to produce silicon-on-insulator substrates; it licensed SOI technology to Shin-Etsu Handotai in 1997 and was listed on Euronext Paris in 1999. [https://www.soitec.com/home/group/corporate/history] [https://www.soitec.com/home/technology/innovation/smart-cut] [https://www.soitec.com/home/group] In 2006, construction began on its 300-mm SOI wafer facility in Singapore. [https://www.mti.gov.sg/newsroom/mr-s-iswaran-at-the-groundbreaking-ceremony-of-soitec-s-300mm-silicon-on-insulator--soi--wafer-fabrication-facility/]\n\nIn 2015, Soitec announced a strategic refocus on its electronics business and an agreement concerning its solar assets; its FY2016–17 reporting subsequently treated Solar Energy as discontinued operations. [https://www.soitec.com/home/group/corporate/newsroom/press-releases/2015/05/28/fy15-consolidated-sales-at-222.9-million-euros-fy15-consolidated-current-operating-losses-at--125.9-million-euros-strategic-refocusing-on-core-business--signing-agreement-with-concensolar-new-financing-closed-in-may-2015] [https://www.soitec.com/docs/default-source/financial-reports/2016-2017/en/soitec_ddr2016_va.pdf] The company announced volume manufacturing of 300-mm RF-SOI substrates in 2016 and launched an FD-SOI pilot line in Singapore in 2017. [https://www.soitec.com/home/group/corporate/newsroom/press-releases/2016/02/18/soitec-announces-volume-manufacturing-of-300-mm-rf-soi-susbtrates-for-the-growing-4g-lte-advanced-mobile-communications-market] [https://www.soitec.com/home/group/corporate/newsroom/press-releases/2017/09/14/soitec-launches-fd-soi-pilot-line-in-singapore]\n\nSoitec expanded beyond silicon with its 2019 acquisition of Belgian GaN company EpiGaN, followed by its 2021 acquisition of silicon-carbide technology company NOVASiC. [https://www.soitec.com/home/group/corporate/newsroom/press-releases/2019/05/13/soitec-expands-its-engineered-substrate-portfolio-into-gan-%28gallium-nitride%29-with-the-acquisition-of-epigan-nv] [https://www.soitec.com/home/group/corporate/newsroom/press-releases/2021/11/30/soitec-acquires-novasic-to-strengthen-its-silicon-carbide-wafer-technology] It inaugurated a Bernin plant dedicated to SmartSiC substrates in 2023. [https://www.soitec.com/home/group/corporate/newsroom/press-releases/2023/09/28/soitec-opens-new-plant--positioning-smartsic--as-a-future-electric-vehicle-standard] Founder Auberton-Hervé was appointed chairman emeritus in 2015; Pierre Barnabé succeeded Paul Boudre as CEO in 2022, and Laurent Rémont became CEO effective April 1, 2026. [https://www.soitec.com/home/group/corporate/newsroom/press-releases/2015/09/15/soitec%27s-founder-appointed-chairman-emeritus-of-the-soitec-group] [https://www.soitec.com/docs/default-source/financial-reports/2021-2022/en/press-release-ceo-2022-01-19-en_final.pdf] [https://www.soitec.com/docs/default-source/financial-reports/2025-2026/en/2026-01-08---soitec-board-of-directors-appoints-laurent-r%C3%A9mont-chief-executive-officer-effective-april-2026.pdf?Status=Master&sfvrsn=fbf3db06_1]\n[P142555210][P142555055][https://www.soitec.com/home/group/corporate/history][https://www.soitec.com/home/technology/innovation/smart-cut][https://www.soitec.com/home/group][https://www.mti.gov.sg/newsroom/mr-s-iswaran-at-the-groundbreaking-ceremony-of-soitec-s-300mm-silicon-on-insulator--soi--wafer-fabrication-facility/][https://www.soitec.com/home/group/corporate/newsroom/press-releases/2015/05/28/fy15-consolidated-sales-at-222.9-million-euros-fy15-consolidated-current-operating-losses-at--125.9-million-euros-strategic-refocusing-on-core-business--signing-agreement-with-concensolar-new-financing-closed-in-may-2015][https://www.soitec.com/docs/default-source/financial-reports/2016-2017/en/soitec_ddr2016_va.pdf][https://www.soitec.com/home/group/corporate/newsroom/press-releases/2016/02/18/soitec-announces-volume-manufacturing-of-300-mm-rf-soi-susbtrates-for-the-growing-4g-lte-advanced-mobile-communications-market][https://www.soitec.com/home/group/corporate/newsroom/press-releases/2017/09/14/soitec-launches-fd-soi-pilot-line-in-singapore][https://www.soitec.com/home/group/corporate/newsroom/press-releases/2019/05/13/soitec-expands-its-engineered-substrate-portfolio-into-gan-%28gallium-nitride%29-with-the-acquisition-of-epigan-nv][https://www.soitec.com/home/group/corporate/newsroom/press-releases/2021/11/30/soitec-acquires-novasic-to-strengthen-its-silicon-carbide-wafer-technology][https://www.soitec.com/home/group/corporate/newsroom/press-releases/2023/09/28/soitec-opens-new-plant--positioning-smartsic--as-a-future-electric-vehicle-standard][https://www.soitec.com/home/group/corporate/newsroom/press-releases/2015/09/15/soitec%27s-founder-appointed-chairman-emeritus-of-the-soitec-group][https://www.soitec.com/docs/default-source/financial-reports/2021-2022/en/press-release-ceo-2022-01-19-en_final.pdf][https://www.soitec.com/docs/default-source/financial-reports/2025-2026/en/2026-01-08---soitec-board-of-directors-appoints-laurent-r%C3%A9mont-chief-executive-officer-effective-april-2026.pdf?Status=Master&sfvrsn=fbf3db06_1]", 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